Intern, Signal Integrity Engineer

Role Summary

This internship position is available in the PBM (Packaging, Boards and Multiphysics) team at Arm. The intern will work on developing innovative packaging solutions by collaborating with various teams, focusing on areas like signaling and signal integrity within new products for emerging markets.

Experience Level

Entry-level internship for students enrolled in Electrical Engineering or related fields.

Responsibilities

The intern will be responsible for:

• Applying signal integrity domain expertise to influence design and perform analysis on SoC, packaging, and board.
• Designing, modeling, and simulating signal integrity for datacenter platforms.
• Performing electromagnetic extraction, frequency time domain simulation, and IO link analysis.
• Collaborating closely with SoC architects and package board designers to drive architectural decisions and ensure system-level performance.

Requirements

Candidates should meet the following requirements:

• Enrollment in a degree program in Electrical Engineering (Bachelors, Masters, or PhD students are welcome).
• Good knowledge of transmission line theory and electromagnetics.
• Proficiency in Ansys/Cadence electromagnetic extraction tools.
• Experience with spice simulation and Keysight ADS.
• Understanding of PCIe, DDR, LPDDR die-to-die interfaces.
• Familiarity with IC package and PCB layout tools.

Education Requirements

Expected to be enrolled in a degree program in Electrical Engineering or related fields.

About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.