Intern - HBM SoC RTL Design Engineer

Job Title

Intern - HBM SoC RTL Design Engineer

Role Summary

Intern in the Heterogeneous Integration Group (HIG) contributing to RTL design and integration for HBM logic die. Work with architecture, verification, physical design, firmware, and product teams to deliver robust, high-performance SoC solutions and help integrate AI-enabled workflows into the design process.

Experience Level

Entry-level internship.

Responsibilities

Primary responsibilities include RTL design, IP integration, and supporting validation and integration activities.

• Design and implement SystemVerilog/Verilog RTL for SoC-level blocks and subsystems used in HBM logic die.
• Integrate internal and third-party IP (controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY-adjacent logic).
• Translate architectural and micro-architectural specifications into RTL with SoC architects.
• Participate in SoC-level integration: clocking, reset, power intent, and configuration infrastructure.
• Assist with pre-silicon validation and post-silicon bring-up, including root-cause analysis of silicon issues.
• Contribute to design documentation, block specifications, and design reviews.
• Collaborate with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure manufacturability.

Requirements

Must-have technical skills and tool experience.

• Proficiency in SystemVerilog/Verilog and familiarity with SoC integration methodologies.
• Experience with RTL-to-GDS flow: synthesis, static timing analysis, and sign-off considerations.
• Familiarity with EDA tools from Cadence, Synopsys, and/or Siemens.
• Programming or scripting experience (Python, TCL, Perl, or shell scripting).

Nice-to-have:

• Experience with HBM, DRAM, or memory-centric SoC designs.
• Familiarity with high-speed interfaces, clocking strategies, reset architectures, and power management.
• Understanding of Agentic AI or willingness to learn AI-enabled workflows.

Education Requirements

Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field. Cannot graduate prior to December 2027 and must be available for a 6-month internship.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.