IC Packaging Engineer - WLP

Job Title

IC Packaging Engineer - WLP

Role Summary

Member of the Wafer Level Packaging (WLP) team responsible for developing next-generation WLP and 2.5D/3D packaging solutions. Work includes package concept exploration, prototype evaluation, process development toward mass production, and cross-functional collaboration with design, test, reliability, product, foundry, and OSAT partners.

Experience Level

Mid-level. The posting does not specify a years-of-experience requirement.

Responsibilities

Contribute to technology development and package integration from concept to prototype and production readiness. Collaborate across engineering disciplines and external partners.

• Support packaging technology development, including advanced 2.5D/3D and wafer-level packaging (WLP).
• Contribute to multi-functional SoC package integration with design, test, characterization, reliability, and product teams.
• Perform package architecture trade-off studies and prototype evaluations.
• Collaborate with foundry and OSAT partners on build execution, design-of-experiments (DOEs), and data analysis.
• Own well-scoped technical deliverables end-to-end (characterization, modeling, failure analysis, product development).
• Travel internationally as required (approximately 5%).

Requirements

Essential technical abilities and collaboration skills required to execute packaging development and integration tasks.

• Strong engineering fundamentals and a solution-oriented mindset; ability to learn quickly and solve technical problems.
• Experience working independently and orchestrating projects with cross-functional teams and external suppliers.
• Ability to perform characterization, data analysis, and support modeling/failure analysis efforts.
• Good program management and communication skills; strong interpersonal skills for multi-functional and international collaboration.
• Familiarity with materials characterization or failure analysis methods is advantageous.
• Nice-to-have: exposure to wafer-level packaging, 2.5D/3D packaging, memory packaging, assembly processes, IC packaging materials, reliability standards, and relevant FA techniques.

Education Requirements

Minimum: Bachelor's degree (required). Preferred: MS or PhD in a relevant discipline. Relevant fields mentioned include semiconductor packaging, materials science, thermal/mechanical/electrical modeling or related technical disciplines. Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab is noted as preferred.

About the Company

Company: Apple

Headquarters: Cupertino, California, United States

Apple is a multinational technology company that designs, manufactures, and sells consumer electronics, software, and online services. Known for its innovative products such as the iPhone, Mac computers, and iPad, Apple emphasizes a strong commitment to high-quality design and user experience.