IC Design Engineer
BroadcomJob Title
IC Design Engineer
Role Summary
Member of the Mixed-Signal ASIC Implementation team responsible for physical implementation of mixed-signal and digital ASICs across consumer and satellite products.
Work includes floorplanning, power and clock planning, physical verification, timing closure, and collaboration with design, IP, synthesis/STA, and library teams.
Experience Level
Senior — position expects an experienced engineer (guidance provided in Education Requirements: typically 10–12+ years of relevant industry experience).
Responsibilities
Primary responsibilities include full-chip and block-level physical implementation and delivery for high-volume and specialty ASIC projects.
- Lead physical implementation for chips across nodes from ultra-low-power 40nm to 7nm, including block and top-level implementation.
- Floorplanning for multi-power-domain designs, power-grid planning, block shaping, and clock-tree implementation.
- Coordinate with design, IP, library, synthesis/STA owners, and RTL teams to meet physical and power-intent requirements.
- Perform physical verification at block and chip level and resolve issues.
- Conduct static and dynamic IR-drop analysis and signal/power EM checks.
- Develop and improve physical design and timing-closure methodologies and flows.
- Integrate analog blocks, ESD/IO pad ring considerations, and work with packaging types (flip-chip, WLCSP) where applicable.
Requirements
Key technical skills and hands-on tool experience required or strongly preferred.
- Extensive hands-on experience with Cadence Innovus (essential) and physical implementation flows.
- Experience with verification and signoff tools such as Calibre; knowledge of timing closure, Formality, LEC is expected.
- Multiple tapeouts experience and proven delivery on ASIC projects.
- TCL scripting is required; Python is a plus.
- Experience collaborating with synthesis and STA teams on physical implementation and power intent.
- Knowledge of ESD, IO pad ring, analog integration, and exposure to package types (flip-chip, WLCSP) is a plus.
- Familiarity with static/dynamic IR drop and EM analysis.
- Knowledge or experience with AI tools is preferable.
Education Requirements
BS in Electrical Engineering plus ~12 years of relevant experience, or MS in Electrical Engineering plus ~10 years of relevant experience. Fields referenced: Electrical/Electrical Engineering. (No other degrees or "equivalent experience" language specified in the posting.)
About the Company
Company: Broadcom
Headquarters: Irvine, California, United States
Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.
