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High-Speed I/F Subsystem Design Leader

Renesas
March 31, 2026
Full-time
On-site
Kodaira, Tokyo, Japan
Level - Senior

Role Summary

The role involves leading the development of high-speed interface subsystems in automotive SoCs, specifically the R-Car series. The position focuses on establishing specifications and architecture, engaging in logical design and validation phases, and collaborating with external partners.

Experience Level

Senior

Responsibilities

Key responsibilities include:

  • Developing specifications and architectures for high-speed interface subsystems in automotive SoCs.
  • Organizing design considerations for subsystems, ensuring overall optimization.
  • Participating in technical discussions and making design decisions during the logical design and validation phases.
  • Coordinating with IP vendors to ensure technical specifications are met.
  • Collaborating globally with teams in India and Vietnam in English.

Requirements

Must-have skills and qualifications include:

  • Practical experience in specification review, design, verification, and performance evaluation in PCIe, UCIe, USB, or UFS.
  • Experience in organizing design policies and technical points based on requirement specifications.
  • Understanding of logical design and verification processes, actively engaging in design reviews.
  • Strong communication skills to facilitate technical consensus.
  • Ability to participate in English technical discussions.
  • Business-level proficiency in Japanese.

Nice-to-have skills include:

  • Experience in leading technical discussions at the subsystem or IP level.
  • Experience in SoC integration involving PCIe, UCIe, USB, or UFS.
  • Knowledge of power-separation design and physical design (P&R).
  • Experience in automotive SoC development or reliability design and verification.
  • Experience in technical negotiations with IP vendors or overseas sites.

Education Requirements

Not specified.


About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.

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Date Posted: 2026-03-31