HBM Memory Subsystem Architect – Principal Engineer

Role Summary

The HBM Memory Subsystem Architect – Principal Engineer role involves design and development of next-generation HBM DRAM products. You will work as part of a multi-functional team collaborating with internal and external partners to define and develop innovative memory subsystem architectures aligning with customer needs and technology trends.

Experience Level

Senior level with a minimum of 10 years of experience in memory subsystem architecture and design.

Responsibilities

Key responsibilities include:

• Develop innovative memory subsystem architectures for HBM-based AI/ML solutions.
• Define memory and RAS architecture requirements and drive end-to-end architectural specifications.
• Collaborate with partners to develop novel architectures and detailed IP requirements.
• Lead engagement with IP vendors for interface IP and functional IP blocks.
• Analyze benchmarks and simulation results to drive innovation opportunities.
• Perform performance and performance/Watt modeling and generate specifications.
• Partner with RTL and validation teams to ensure successful subsystem implementation.
• Drive microarchitecture definition and participate in performance simulation.

Requirements

Must-have qualifications include:

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
• Minimum of 10 years of experience in memory subsystem architecture.
• Deep understanding of memory controller design and various memory types.
• Experience with PHY design and signal integrity issues.
• Proficiency in Network-on-Chip (NoC) architecture.
• Familiarity with industry-standard bus protocols (e.g., AXI, AMBA).
• Strong analytical and problem-solving skills.
• Excellent communication skills.

Preferred qualifications include:

• A PhD in a relevant field.
• Familiarity with EDA tools for design and verification.
• Experience with multi-core systems and industry IO protocols.
• Knowledge of serial link protocols is desired.

Education Requirements

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field required.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.