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Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)

Micron Technology
July 13, 2026
Full-time
On-site
Taichung, TW
Test Engineering Jobs, Level - Senior

Job Title

Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)

Role Summary

Lead global product integration efforts across test, yield and packaging to improve product yield, quality, and benchmark performance for Micron front-end products. Work with cross-functional teams (Product, Test, Yield, Design, Fab, Packaging, Quality, Technology Development) to centralize information, drive execution, and deliver manufacturing-ready solutions.

Experience Level

Senior-level (Senior / Staff / Principal). Specific years of experience not stated.

Responsibilities

Primary responsibilities focus on coordinating technical integration, driving yield improvements, and leading cross-site taskforces to resolve product and test issues.

  • Lead and drive global product integration initiatives to improve yield, quality, and performance across nodes and products.
  • Centralize and synthesize project information (design requirements, test challenges, yield learnings) from global teams and drive follow-through to closure.
  • Analyze end-to-end test flow, product design/operation, packaging interactions, and manufacturing processes to enable yield breakthroughs while balancing yield and reliability.
  • Characterize device failure modes using knowledge of device architecture, physics, packaging interactions, and available test/process knobs.
  • Define and drive packaging technology and chip–package interaction strategies ahead of product qualification.
  • Lead cross-functional and cross-site taskforces to resolve yield and quality challenges promptly.
  • Develop and promote Best‑Known‑Methods (BKM), standardization, and process improvements to increase productivity and efficiency.
  • Maintain strong stakeholder relationships across Fab, TD, Product Engineering, Test Engineering, Quality, and Packaging.
  • Communicate project status, risks, and proposals through clear written reports and technical presentations; escalate issues as needed.
  • Travel to Micron fabs and development sites as required to support execution and alignment.

Requirements

Must-have technical skills and capabilities inferred from the role description.

  • Proven experience leading product integration and yield-improvement initiatives in a semiconductor manufacturing environment.
  • Deep understanding of test flow, product test challenges, and failure analysis.
  • Knowledge of packaging technology and chip–package interactions and how they affect yield and qualification.
  • Ability to synthesize cross-functional technical data and drive actions to closure.
  • Strong cross-functional leadership, stakeholder management, and taskforce facilitation skills.
  • Effective technical writing and presentation skills for status, risk, and proposal communication.
  • Willingness to travel to fabrication and development sites as required.
  • Nice to have: experience with device physics, test methods, and semiconductor failure characterization.

Education Requirements

Not specified.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-07-13