FEOL Integration Engineer

Job Title

FEOL Integration Engineer

Role Summary

Work as an integration engineer within Manufacturing Development Customer Engineering (MDCE) to transition advanced FEOL technologies from development to high-volume manufacturing at Intel's Leixlip fab. The role focuses on executing yield roadmaps, identifying and mitigating yield and performance issues, and supporting new product introductions.

Team location and work model: based in Leixlip, Ireland; eligible for hybrid on-site/off-site work.

Experience Level

Mid-level — requires at least 5 years of relevant industry experience; level of experience will influence job grade.

Responsibilities

Primary responsibilities include technical leadership, cross-functional collaboration, and process optimization to achieve HVM targets.

• Lead engineering projects to execute high-volume manufacturing (HVM) yield roadmaps and meet performance targets.
• Collaborate with Technology Development, Local Yield, FEOL/BEOL Integration, Device, Defect Reduction, and Yield Analysis teams to identify root causes and implement mitigation plans.
• Conduct feasibility studies and experiments to characterize processes and improve product performance.
• Manage New Product Introductions (NPI) in production fabs and optimize processes to meet foundry customer specifications.
• Partner with local yield teams to improve product yield, quality, performance, and reduce wafer costs.
• Drive technical projects from conception to implementation and communicate complex technical concepts to diverse audiences.

Requirements

Must-have technical skills, industry experience, and interpersonal capabilities. Preferred items are listed separately.

• Experience in advanced-node semiconductor industry with FEOL process integration and high-volume manufacturing.
• Proficient understanding of device physics and experience with FinFET or Gate-All-Around technology development or HVM.
• Familiarity with module processes: lithography, dry etch, wet etch, CMP, diffusion, implant, thin films, and metrology.
• Demonstrated problem-solving skills, initiative, and ability to learn independently.
• Strong collaboration skills across multifunctional, multicultural teams and effective verbal/written communication.
• Proven ability to lead and drive technical projects to completion.

Nice-to-have:

• Project/program management or TFT lead experience.
• Experience engaging with external foundry customers and working on new semiconductor technology development.
• Extensive fabrication process engineering background across advanced patterning, etch, diffusion, thin-film deposition, and CMP.
• Semiconductor foundry experience.

Education Requirements

Minimum: Bachelor's degree in a relevant science or engineering field plus at least 5 years' experience. Preferred: advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics, Materials Science, or related fields; related industry experience may be considered in lieu of degree specifics.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.