Job Title
Experienced Laser Development Engineer (ATD)
Role Summary
Join Intel's Packaging Module Development team in Laser Assembly to design and develop laser-based packaging processes and related equipment. The role focuses on process development, manufacturability, and reliability to support next-generation semiconductor packaging technologies.
You will work with cross-functional teams and suppliers to define process specifications, drive qualification and standardization, and resolve process and equipment issues that affect quality, yield, and cost.
Experience Level
Mid-level. Typical experience expectations depend on degree: Bachelor's +4 years, Master's +3 years, PhD +6 months (per job minimums).
Responsibilities
Key responsibilities center on developing and industrializing laser assembly packaging processes and ensuring they meet quality, reliability, cost, and yield targets.
- Design and develop laser assembly packaging processes and associated equipment.
- Optimize manufacturing processes for quality, reliability, yield, cost, and productivity.
- Develop process and equipment specifications using Design of Experiments (DOE) and data analysis.
- Manage end-to-end packaging process flows and manufacturability of physical layouts.
- Establish laser process specifications and work with suppliers to meet performance standards.
- Develop techniques and quality screens to detect packaging quality and reliability issues early.
- Define laser process reliability requirements informed by failure-mechanism analysis.
- Drive standardization in qualification procedures and manufacturing quality systems.
- Influence material selection, process design, and equipment development to meet product requirements.
Requirements
Must-have technical skills and experience required to perform the role.
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Must-have: Proficiency in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
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Must-have: Demonstrated experience applying engineering principles to develop laser solutions for manufacturing processes and equipment.
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Must-have: Strong analytical skills: data analysis, risk assessment, and structured problem solving.
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Must-have: Experience developing process and equipment specifications and using DOE to optimize processes.
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Nice-to-have: Hands-on experience in semiconductor packaging or technology manufacturing environments and troubleshooting laser-based equipment/systems.
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Nice-to-have: Familiarity with equipment adjustment, manufacturability assessments, and production troubleshooting in electronics assembly.
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Nice-to-have: Ability to apply data science/statistics tools (Python, NumPy/Pandas, SQL, JMP, Minitab) to large, complex datasets.
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Nice-to-have: Demonstrated ability to collaborate with cross-functional teams and deliver results on time-sensitive projects.
Education Requirements
Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field (with ~4+ years industry experience); OR Master's degree in those fields (with ~3+ years industry experience); OR PhD in Engineering, Physics, Mechanical Engineering, Optical Engineering, or a related STEM field (with ~6 months+ industry experience). Qualifications may also be met through a mix of relevant industry experience, internships, coursework, or research.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Date Posted: 2026-07-09