Engineer, Multi-Physics Sign-off (Timing, PDN & Thermal)
ArmJob Title
Engineer, Multi-Physics Sign-off (Timing, PDN & Thermal)
Role Summary
CAD & Methodology Engineer responsible for developing, enabling, and supporting 3DIC and 2.5D physical design and signoff methodologies for multi-die systems. Work closely with physical design, package, PI, reliability, silicon and EDA vendor teams to deliver production-ready flows spanning timing, power, IR/EM, ESD, thermal, CFD/FEM and multiphysics analysis.
Experience Level
Mid-level. Minimum 5+ years of system-level experience working on advanced-node implementation and signoff for multi-die or advanced packaging systems.
Responsibilities
This is a hands-on role delivering tool flows, methodology and automation for 3DIC/2.5D designs and multi-physics signoff.
- Develop, maintain and qualify CAD flows for 3DIC/2.5D designs, including chiplets, interposers and advanced packaging.
- Enable end-to-end implementation and signoff from floorplanning through tapeout, including die-to-die connectivity and cross-die constraint management.
- Develop STA methodologies for multi-die timing, cross-die constraints and closure strategies.
- Enable power analysis, IR drop and EM signoff flows; define tool qualification, correlation and signoff criteria.
- Develop thermal analysis and CFD/FEM methodologies; support coupled electro-thermal and multiphysics flows.
- Build automation, scripts, checks and infrastructure to improve flow robustness, runtime and usability.
- Produce documentation, examples and training materials; provide CAD support during active design cycles and debug flow issues.
- Collaborate with design, packaging, PI, reliability teams and EDA vendors; support tool evaluations, upgrades and regressions.
Requirements
Key must-have skills and desirable additions for the role.
- Must-have: Strong VLSI knowledge and minimum 5+ years of system-level experience.
- Must-have: Hands-on experience with 3DIC and/or 2.5D designs and familiarity with chiplet-based and system-in-package tradeoffs.
- Must-have: Experience owning flows, strong scripting/automation skills, and demonstrated cross-team collaboration.
- Nice-to-have: Experience with TSVs, micro-bumps, interposers and advanced packaging technologies.
- Nice-to-have: Familiarity with industry tools such as Cadence Integrity 3D-IC, Synopsys 3DIC Compiler, Cadence Celsius Thermal Solver, Ansys Icepak, and Ansys RHSC-ET.
- Nice-to-have: Experience with CFD/FEM thermal solvers and coupled electro-thermal analysis.
Education Requirements
Not specified.
About the Company
Company: Arm
Headquarters: Cambridge, United Kingdom
ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.
