Engineer, HIG HBM

Job Title

Engineer, HIG HBM

Role Summary

Member of the High Bandwidth Memory (HBM) Product Engineering Media Health team responsible for developing and maintaining intrinsic and extrinsic reliability test programs for DRAM, interface die, and stacked HBM products. The role focuses on coding test flows, validating reliability metrics, and ensuring products meet quality, cost, and cycle-time KPIs.

Experience Level

Mid-level. Years of experience not specified.

Responsibilities

Deliver and maintain reliability test programs and test flows, perform validation and data analysis, and collaborate with cross-functional teams to resolve issues and improve processes.

• Write, debug, and maintain reliability test programs for HBM devices, interface die, and stacked products.
• Develop new reliability test flows (e.g., extended wafer-level burn-in, pWLRx, ELFR) for intrinsic and extrinsic DPM assessment.
• Investigate root causes of reliability failures and implement corrective actions.
• Define and validate interface hardware specifications and debug new interface boards.
• Analyze engineering data using statistical tools for validation and risk assessment.
• Drive technical decisions on risk analysis, project prioritization, and test coverage.
• Collaborate with Fab, HBM technology development, design, system development, and quality/reliability teams.
• Identify system and process improvements to reduce cost and improve quality and cycle time.

Requirements

Must-have technical skills and practical experience for immediate contribution.

• Must-have: Strong coding/programming skills in Python and C++.
• Must-have: Proven experience in reliability engineering or related test/product engineering roles.
• Must-have: Strong problem-solving skills with root-cause analysis and attention to detail.
• Must-have: Basic understanding of CMOS technology and DRAM device physics and design.
• Must-have: Knowledge of statistics, data analysis tools, and scripting for engineering validation.
• Must-have: Familiarity with testing and verification approaches and strict adherence to test protocols.
• Must-have: Effective written and verbal communication skills and demonstrated cross-team collaboration.
• Work on site in Singapore; role requires international travel to the US, Taiwan, and Japan.
• Nice-to-have: Experience defining interface board specifications and hardware validation/debug.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering is specified. Product or test engineering experience is expected.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.