Dry Etch Process Development Engineer

Job Title

Dry Etch Process Development Engineer

Role Summary

Work within Micron's Technology Development organization to develop, integrate, and optimize plasma (dry) etch processes for advanced memory devices. The role involves hands-on work with etch tools, chamber hardware, metrology, and data-driven process improvement to move solutions from R&D into manufacturing.

The position is based at the Albany, NY site and requires collaboration with integration, lithography, thin films, device, manufacturing teams, and equipment vendors across multiple Micron sites.

Experience Level

Mid-level. Candidates should have practical semiconductor process development experience; roughly 3+ years of relevant industry experience is typical.

Responsibilities

The role focuses on developing and sustaining dry etch unit processes and improving process performance and yield.

• Develop, qualify, and sustain plasma etch processes for dielectric, conductor, and hardmask applications.
• Optimize metrics such as CD control, profile/anisotropy, selectivity, microloading, uniformity, and LER/LWR.
• Use DOE, SPC, and statistical analysis to drive defect reduction and yield improvement.
• Perform root-cause analysis and implement corrective actions for process excursions and tool health issues.
• Partner with equipment vendors on chamber matching, hardware and recipe development, and new capability evaluations.
• Document process baselines, change controls, and support technology transfer to high-volume manufacturing.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.
• Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).
• Hands-on troubleshooting and root-cause analysis skills for process and tool issues.
• Ability to collaborate across cross-functional technical teams and communicate technical results clearly.
• Familiarity with inline and out-of-line metrology and use of data to control process performance.

Nice-to-have:

• Experience with advanced dry etch platforms (ICP/RIE) and chamber matching across fleets.
• Knowledge of pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks.
• Experience with defect characterization, tool health monitoring, vendor joint development, and technology transfer to high-volume manufacturing.

Education Requirements

Preferred: M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related technical field relevant to plasma processing and semiconductor manufacturing. Candidates with a B.S. plus 3+ years of semiconductor processing experience with emphasis on dry/plasma etch will also be considered.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.