Dry Etch Process Development Engineer

Job Title

Dry Etch Process Development Engineer

Role Summary

Develop, integrate, and optimize plasma dry-etch processes for advanced memory device manufacturing. Work within Technology Development and cross-functional teams to move etch processes from R&D into high-volume manufacturing.

Hands-on role involving etch equipment, chamber hardware, consumables, metrology, and data-driven process control to meet device and manufacturing targets.

Experience Level

Mid-level. Candidates with M.S./Ph.D. or B.S. with relevant experience will be considered; typical experience expectations ~3+ years in semiconductor processing or equivalent.

Responsibilities

Key responsibilities include process development, characterization, and transfer to manufacturing.

• Develop, qualify, and sustain dry etch unit processes (dielectric, conductor, hardmask) for advanced memory technologies.
• Optimize critical metrics: CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and LER/LWR.
• Use metrology, DOE, SPC, and statistical analysis to reduce defects and improve yield.
• Perform root-cause analysis and implement corrective actions for process excursions and tool health issues.
• Partner with equipment vendors on chamber matching, hardware/recipe development, and capability evaluations.
• Document process baselines and change controls; communicate results and support technology transfer to high-volume manufacturing.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.
• Practical experience with semiconductor processing focused on dry etch/plasma etch; typically 3+ years for applicants without advanced degrees.
• Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).
• Ability to collaborate effectively across cross-functional technical teams and present clear results.

Nice-to-have:

• Hands-on experience with advanced dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets.
• Familiarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks.
• Experience with defect characterization techniques, tool health monitoring, and vendor collaborations.
• Experience with technology transfer to high-volume manufacturing and sustaining support in a fab environment.

Education Requirements

M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related technical field preferred. Candidates with a B.S. plus 3+ years of semiconductor processing experience (emphasis on dry/plasma etch) will also be considered.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.