Direct Lid/Stiffener Attach Packaging Module Development Engineer

Job Title

Direct Lid/Stiffener Attach Packaging Module Development Engineer

Role Summary

Package Module Development Engineer responsible for developing and transferring a direct lid/stiffener attach process module within Assembly Technology Development (ATD). The role focuses on process definition, equipment configuration, characterization, and transfer to high-volume manufacturing.

Works with cross-functional teams to meet quality, reliability, cost, yield and manufacturability targets for new product introductions.

Experience Level

Mid-level. Preferred 4+ years of relevant experience in semiconductor process development or equipment engineering; title and responsibilities align with an experienced individual (3–7 years typical).

Responsibilities

Key responsibilities include:

• Define and establish process flows for direct lid/stiffener attach modules, including FMEA, procedures, drawings review, and equipment configuration for NPI products.
• Select and develop materials and equipment (recipes, collaterals) and drive process improvements for quality, reliability, cost, yield, productivity, and manufacturability.
• Plan and run experiments to characterize the process throughout development and volume ramp.
• Develop technical solutions using statistical methods and formal problem-solving tools; perform failure mode characterization and resolution.
• Participate in pathfinding activities such as thermal interface material (TIM) qualification and new failure-mode analysis.
• Establish process control systems and sustain the module during volume ramp and production transfer.
• Train production and receiving process engineers and support transfers to other virtual factories and new factory start-ups.
• Support installation and qualification of new production lines and provide ongoing ramp/troubleshooting support.

Requirements

Must-have and preferred technical skills and experience.

• Must-have: Involvement in research and development in assembly and packaging.
• Must-have: Knowledge of statistical design of experiments and formal problem-solving techniques.
• Preferred: Experience in process development and equipment engineering in the semiconductor industry (4+ years preferred).
• Preferred: Experience with lid/IHS (integrated heat spreader), stiffener attach, and dispensing processes.
• Preferred: Familiarity with data/statistical tools (e.g., JMP, SQL); AI/ML experience is a plus.
• Work model: On-site presence required.

Education Requirements

Bachelor's or Master's degree in a relevant science, engineering, or technology field such as Physics, Mechanical, Chemical, Electrical, Electronic, or Materials Engineering.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.