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Digital IC Design Engineering Intern

Texas Instruments
February 25, 2026
Internship
On-site
Shanghai, Shanghai, China
Level - Entry or Early Career

Job Title

Digital IC Design Engineering Intern

Role Summary

This internship program targets graduates from November 2026 to October 2027. As a Digital IC Design Engineering Intern at Texas Instruments, you will be involved in architecting new products and turning customer visions into reality. Your role will encompass defining, designing, and documenting integrated circuits across various exciting applications.

Experience Level

Internship, suitable for students currently pursuing their degree.

Responsibilities

Your key responsibilities will include:

  • Partnering with business teams and system engineering to develop design specifications.
  • Providing analysis on chip architecture trade-offs for performance optimization.
  • Participating in design reviews and documenting the design process.
  • Collaborating on IC layouts to maintain performance standards.
  • Characterizing prototypes, developing test specifications, and coordinating product releases.
  • Driving behavioral models.

Requirements

The minimum requirements for this position are:

  • Currently pursuing a Bachelor's degree in Electrical Engineering or related fields.
  • Cumulative GPA of 3.0/4.0 or higher.

Preferred qualifications include strong communication skills, ability to work in teams, and problem-solving abilities.

Education Requirements

A Bachelor's degree in Electrical Engineering, Electronics Technology, Computer Engineering, or a related field is required.


About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.

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Date Posted: 2026-02-25