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Device Modeling Engineer, Senior

Qualcomm
April 22, 2026
On-site
Tijuana, Baja California, Mexico
Level - Mid-Career

Role Summary

The Device Modeling Engineer will be responsible for developing semiconductor device models targeting RF Front End applications. This position demands collaboration with multiple engineering teams to drive technology advancements in analog, digital, and RF circuit designs.

Experience Level

Mid-level; requires a Bachelor's degree in a related field and 2+ years of relevant experience or a Master's degree with 1+ year of relevant experience.

Responsibilities

The key responsibilities include:

  • Design and perform characterizations of semiconductor devices (IV, CV, small and large signal etc.).
  • Analyze large data sets and summarize findings of semiconductor devices.
  • Circuit simulation from single devices to larger integrated circuits.
  • Compare simulated data to measured data.
  • Develop device level models based on measured data and integrate into the design environment.

Requirements

A successful candidate will possess:

  • Bachelor’s degree in Electrical Engineering or equivalent experience.
  • Experience with electronics lab hardware.
  • Proficiency in one or more programming languages (e.g., Python, C++).
  • Solid understanding of semiconductor devices design and usage.
  • Excellent problem-solving and communication skills.

Education Requirements

Required: Bachelor's degree in Science, Engineering, or related field; or Master's degree with related experience; or PhD in a related field.


About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.

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Date Posted: 2026-04-22