Custom HBM Architecture and Design Engineer, Senior Member of Technical Staff (SMTS)

Job Title

Custom HBM Architecture and Design Engineer, Senior Member of Technical Staff (SMTS)

Role Summary

Design and architect custom High Bandwidth Memory (HBM) solutions for next-generation AI, HPC, and data-centric systems. Work across the full product lifecycle—from early architecture and circuit innovation through physical design, silicon validation, and high-volume manufacturing—within a cross-functional team.

Experience Level

Senior-level (SMTS). Typically a senior individual contributor role; expect extensive industry experience consistent with senior engineering positions (generally 7+ years).

Responsibilities

You will lead HBM architecture and system-design tasks and partner with multiple engineering disciplines to deliver production memory products.

• Define architecture and interfaces for custom HBM stacks targeting AI/HPC workloads.
• Produce design specifications spanning PHY, controller, and memory subsystem integration.
• Collaborate with circuit design, physical design, packaging, process integration, and test teams.
• Drive design trade-offs for bandwidth, power, area, and reliability; participate in design reviews.
• Lead silicon bring-up, validation, characterization, and debug of memory subsystems and high‑speed interfaces.
• Support transfer to manufacturing and high-volume production, including yield and reliability improvements.
• Mentor engineers and contribute to technical strategy and decision-making as a senior technical staff member.

Requirements

Core qualifications and skills expected for successful performance in this role.

• Must-have: Proven experience in memory architecture or HBM/system-memory design and delivery across multiple stages of the product lifecycle.
• Must-have: Experience working with circuit design, physical design, packaging, validation, and test teams in a cross-functional environment.
• Must-have: Demonstrated ability to lead technical work, make architecture-level trade-offs, and drive silicon validation and bring-up.
• Must-have: Strong communication and collaboration skills for coordinating across engineering and manufacturing teams.
• Nice-to-have: Experience with 3D-stacked memory, high-speed PHY design, modeling/simulation tools, scripting for automation, or prior contributions to production HBM products.

Education Requirements

Not specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.