CUF TD Module Engineer

Job Title

CUF TD Module Engineer

Role Summary

The CUF TD Module Engineer will develop and optimize assembly and packaging processes and equipment to support Intel Foundry advanced packaging roadmaps. Work includes process development, reliability and qualification testing, material and vendor specification, and cross-functional collaboration with packaging technology and partner engineering teams.

This role is part of a manufacturing/technology development team and requires regular on-site presence at the Kulim facility to perform hands-on process and equipment work.

Experience Level

Mid-level. The posting targets experienced hires; candidates with approximately 3+ years of relevant industry experience are preferred.

Responsibilities

Key responsibilities include:

• Develop assembly processes and equipment to enable next-generation packaging technologies.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity and manufacturability targets.
• Define process and equipment specifications, apply design of experiments and data analysis, and document improvements.
• Develop and maintain equipment to evaluate silicon and package technologies under simulated field conditions (heat, humidity, temperature cycling, dynamic forces).
• Ensure manufacturability of package designs and oversee manufacturing process flows and procedures.
• Establish material specifications for contract assemblers and raw material vendors and work with supplier quality and procurement to ensure vendor performance.
• Develop techniques, acceleration methods, tools, and quality screens for early identification of packaging quality and reliability issues.
• Set reliability requirements and influence design, material selection and process development based on failure-mechanism understanding.
• Lead problem-solving and continuous improvement efforts using experimental design and statistical methods.
• Provide consultation on packaging issues and respond to customer or internal events as needed.

Requirements

Must-have and preferred skills and experience:

• Must-have: Fundamental understanding of semiconductor assembly equipment and processes.
• Must-have: Experience in process development, experimental design (DOE) and data analysis for manufacturing processes.
• Must-have: Knowledge of reliability testing, qualification methods, and failure-mechanism analysis for packages.
• Must-have: Ability to define material specifications and coordinate with suppliers, quality and procurement.
• Must-have: Strong problem-solving skills and experience applying statistical methods to process improvement.
• Must-have: Ability to work on-site regularly at the Kulim facility.
• Nice-to-have: Experience developing hardware or toolsets for process implementation.
• Nice-to-have: Experience with thermal/fluid aspects of packaging or assembly-process engineering.

Education Requirements

Prefer candidates with an M.Sc. or Ph.D. in Mechanical Engineering, Materials Engineering, Electrical Engineering, Chemical Engineering, Physics or a related field with focus on thermal/fluid/packaging assembly process engineering; a Bachelor's degree with strong relevant experience will also be considered. Posting indicates preference for candidates with at least 3 years of relevant working experience; equivalent practical experience may be acceptable.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.