Role Summary
The Characterization Engineer works on characterizing different high speed and low power memory architectures, focusing on timing, power, leakage, and peak measurements. This role collaborates with team members and requires effective communication across multiple sites.
Experience Level
Mid-level, requiring a minimum of 2 years of relevant experience.
Responsibilities
Key responsibilities include:
- Understanding different high speed and low power memory architectures.
- Writing vectors and measurements to characterize timing, power, leakage, and peak.
- Understanding memory front end views and related quality assessments.
- Collaborating with team members for timely delivery and improvement of flow and methodology.
- Maintaining effective communication across multiple sites and groups.
Requirements
Requirements for the position:
- Master's or Bachelor's degree in electronics.
- At least 2 years of working experience in memory design.
- Experience in developing embedded SRAM/ROM with a compiler approach.
- Fundamental knowledge of bit cell characteristics (SNM, WM, cell current, standby current, data retention).
- Understanding of process variability effects on memory design.
- Strong understanding of digital and memory circuit design/layouts.
- Knowledge of critical path modeling concepts and various types of models (RC, C, Pai, ladder, distributive, etc.).
- Good knowledge of semiconductor physics and IC technology.
Education Requirements
Master's or Bachelor's degree in electronics is required.
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.

Date Posted: 2026-04-16