Career Accelerator Program - Packaging Engineer (PhD)

Job Title

Career Accelerator Program - Packaging Engineer (PhD)

Role Summary

TI's Career Accelerator Program (CAP) is a 12-month development program for new college graduates within the TMG organization. This packaging engineer role supports the design, development, and analysis of semiconductor packaging technologies to enable miniaturization, reliability, and performance for analog and embedded products.

The role involves cross-functional collaboration across design, qualification, and manufacturing teams and hands-on work with materials, processes, and modeling to accelerate product readiness.

Experience Level

Entry-level - program is targeted at new college graduates. (PhD degree required.)

Responsibilities

Primary responsibilities include technical development, qualification support, and cross-functional collaboration to advance packaging solutions:

• Design and develop semiconductor packaging solutions (wirebond, flip‑chip, modules, SiPs, advanced packages) at various readiness levels.
• Participate in cross‑functional teams to support product qualification, production readiness, reliability, and yield objectives.
• Plan and execute design‑of‑experiments and work with material suppliers to select materials that improve reliability and performance.
• Create and use electrical, mechanical, and thermal models to evaluate silicon‑to‑package interactions and establish design rules.
• Support testability and test coverage efforts; help prevent high‑risk designs through analysis and modeling.
• Use fabrication and characterization tools (inspection, X‑ray, materials characterization, failure analysis) to validate designs.
• Document technical results and communicate findings to engineering and business stakeholders.

Requirements

Minimum technical requirements beyond the degree are not explicitly listed. Preferred skills and experience include:

• Coursework or research in semiconductor packaging, fabrication, or integration.
• Experience with AutoCAD or similar CAD tools and finite‑element (FEM) modeling.
• Strong fundamentals in heat transfer, thermodynamics, and stress analysis.
• Experience with MEMS/3D integration, wafer bumping, optical packaging, or related processes.
• Hands‑on experience with thin film deposition (CVD, PVD), electroplating, plasma etch, adhesion and surface treatment processes.
• Experience using characterization and inspection equipment (VI scopes, X‑ray, materials characterization, failure analysis).
• Strong written and verbal communication, analytical and problem‑solving skills, and ability to work effectively in teams.
• Time management, initiative, and ability to work in a fast‑paced, changing environment.

Education Requirements

PhD (Doctorate) required in Materials Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering, or a closely related field. A cumulative GPA of 3.0/4.0 or higher is specified. No mention of equivalent professional experience in lieu of the PhD.

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.