Career Accelerator Program - Packaging Engineer (MS/PhD)

Job Title

Career Accelerator Program - Packaging Engineer (MS/PhD)

Role Summary

Participate in TI's 12-month Career Accelerator Program as a packaging engineer, working on the design, development, and analysis of semiconductor packaging technologies (wirebond, flip chip, modules, SiP, and other advanced packages).

Collaborate with cross-functional teams, suppliers, and product teams to support qualification, production, reliability, yield, and performance targets.

Experience Level

Entry-level (new graduate). Intended for recent master's or PhD graduates; typically 0–2 years of professional experience.

Responsibilities

The role focuses on technical development and cross-functional support for semiconductor packaging.

• Design and develop packaging solutions across a range of technologies (wirebond, flip chip, modules, SiP, advanced packages).
• Support product qualification and production to meet reliability, yield, testability, and test-coverage requirements.
• Plan and execute design-of-experiments; evaluate and downselect materials with suppliers.
• Develop electrical, mechanical, and thermal models to understand silicon-to-package interactions and establish design rules.
• Work with cross-functional teams to deliver project milestones and drive technical results during the development program.

Requirements

Core technical and professional skills expected from candidates. (Degree and GPA requirements are listed under Education Requirements.)

• Analytical problem-solving skills and engineering judgment.
• Strong written and verbal communication; demonstrated ability to work effectively on cross-functional teams.
• Time management, initiative, and adaptability in a fast-paced environment.
• Nice-to-have: mechanical stress analysis and modeling experience (e.g., ANSYS).
• Nice-to-have: hands-on mechanical characterization of materials (metals/alloys, polymers, ceramics).
• Nice-to-have: semiconductor back-end-of-line processing or packaging manufacturing/assembly/reliability experience.

Education Requirements

Master's degree in Mechanical Engineering, Physics, or a related field required; MS or PhD acceptable. Minimum cumulative GPA 3.0/4.0 (preferred 3.5/4.0). No alternative-equivalency language provided.

About the Company

Company: Texas Instruments

Headquarters: Dallas, Texas, USA

Texas Instruments is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for various markets including industrial, automotive, and personal electronics. The company's innovations aim to make electronics more affordable and reliable, fostering advancements in technology through each generation of semiconductors.