Assembly Packaging Technical Integrator - Intel Foundry Services MAG

Job Title

Assembly Packaging Technical Integrator - Intel Foundry Services MAG

Role Summary

The Product Packaging Engineer designs, develops, and qualifies packaging solutions to meet product, regulatory, and sustainability requirements for Intel Foundry customers. The role works across manufacturing, logistics, supply chain, and external vendors to enable scalable, compliant, and cost-effective packaging and distribution.

Experience Level

Mid-level. Typical experience guidance: 6+ years with a Bachelor’s degree, 2+ years with a Master’s degree, or a PhD with relevant academic/research experience in semiconductor or related fields.

Responsibilities

Deliver technical packaging solutions, drive cross-functional integration, and qualify suppliers to support production and customer programs.

• Design, develop, and qualify packaging solutions, materials, artwork, prototypes, and specifications.
• Lead packaging development and create detailed technical documentation and bills of material.
• Collaborate with manufacturing, logistics, regulatory, supply chain, and customers to align packaging with production and distribution needs.
• Perform risk analyses and ensure compliance with regulations and Intel quality standards.
• Identify and implement cost-saving, waste-reduction, and sustainability initiatives.
• Evaluate and qualify vendors for scalable, high-quality packaging manufacturing.
• Integrate technical efforts across assembly process technology, package assembly design, yield and reliability analysis, and statistical model-based analysis.

Requirements

Key technical skills and experience required or strongly preferred.

• Must-have: Hands-on experience with semiconductor packaging assembly and production processes; experience integrating assembly/process and package design technology.
• Must-have: Experience with yield, package reliability, and statistical/data analysis applied to packaging or manufacturing problems.
• Must-have: Experience creating technical specifications, prototypes, artwork, and detailed documentation.
• Must-have: Experience conducting vendor evaluation and qualification for packaging materials and suppliers.
• Must-have: Strong communication, cross-functional collaboration, and program/customer-facing skills.
• Nice-to-have: Knowledge of Design for Manufacturing (DFM) principles and optical packaging technologies.
• Nice-to-have: Prior work in semiconductor manufacturing environments and familiarity with supply chain/logistics considerations for product distribution.

Education Requirements

Bachelor’s degree in Engineering, Materials Science, Physics, Chemistry, or a related technical field is specified. Experience guidance: 6+ years with a Bachelor’s degree, 2+ years with a Master’s degree, or a PhD with relevant academic/research experience in semiconductor industry processes, semiconductor packaging, optics, or optical packaging technologies.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.