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ASIC Design Support Engineer (Up to Principal Level)

Qualcomm
April 16, 2026
Full-time
On-site
Shanghai, Shanghai, China
Level - Senior

Role Summary

The ASIC Design Support Engineer will manage end-to-end ASIC/SoC design outsourcing projects, leading multi-site engineering teams to ensure timely project delivery aligned with client specifications.

Experience Level

Senior level - Minimum 5+ years of experience in ASIC/SoC/FPGA design and at least 3+ years in ASIC design outsourcing services are preferred.

Responsibilities

The key responsibilities include:

  • Leading full-flow ASIC/SoC design outsourcing projects across all phases, from proposal to post-silicon validation.
  • Acting as the primary contact for customer project management, ensuring clear communication and managing scope changes.
  • Coordinating cross-functional teams and optimizing resources across multiple projects.
  • Identifying and mitigating project risks and enforcing quality standards.
  • Driving continuous process improvements to enhance delivery efficiency and customer satisfaction.

Requirements

Applicants should have:

  • Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, Computer Engineering, or a related field.
  • A minimum of 5+ years of relevant working experience, with a track record in end-to-end ASIC project management.
  • Deep knowledge of the full ASIC design flow and mainstream EDA tools.
  • Excellent client communication and project management skills.

Education Requirements

Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field, or an advanced degree with additional years of experience.


About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.

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Date Posted: 2026-04-16