Applications Engineering, Staff Engineer — 3DIC

Job Title

Applications Engineering, Staff Engineer — 3DIC

Role Summary

Lead deployment and customer enablement of Synopsys EDA solutions focused on 3DIC and advanced packaging. The role partners with R&D, Product Engineering, and Applications Engineering to develop and validate tool flows and methodologies for multi-die and chiplet-based systems.

Primary mission: solve customer technical challenges, drive adoption of advanced physical design and signoff flows, and influence product and methodology direction through field feedback and hands-on engagements.

Experience Level

Senior — minimum 9 years of relevant industry experience.

Responsibilities

You will provide technical leadership and hands-on support for advanced packaging and 3DIC customer engagements.

• Lead deployment, release support, and ongoing technical support of EDA solutions for 3DIC and advanced packaging customers in Taiwan and the region.
• Develop, validate, and maintain EDA tool flows and methodologies for SoC, chiplet, and multi-die systems.
• Partner with R&D, Product Engineering, and Applications teams to translate customer requirements into robust flows and product improvements.
• Act as a technical advisor for design optimization, signoff, and adoption of Synopsys 3DIC capabilities.
• Capture, refine, and document flow requirements and best practices from field experience.
• Define and deliver cross-product flows and features, and promote knowledge sharing across teams.
• Build and maintain strong relationships with customers, product management, and engineering teams to influence product direction.

Requirements

Must-have technical skills and experience; a concise list of core qualifications follows.

• Minimum 9 years of industry experience in semiconductor physical design, implementation, or applications engineering focused on 3DIC/multi-die systems.
• Strong proficiency with physical design tools and methodologies (place-and-route, STA signoff, SI/PI, EM/IR, DRC/LVS). Familiarity with ICC2 or Fusion Compiler is expected.
• Proven experience developing and automating CAD flows; strong scripting skills in Tcl required. Perl and/or Python highly desirable.
• Hands-on experience implementing 3DIC or multi-die package designs in SoC or system-level integration roles.
• Ability to engage directly with customers, troubleshoot complex design issues, and translate field problems into product or methodology enhancements.

Nice-to-have:

• Experience with RLC extraction (StarRC), analog circuit simulation, voltage-drop/power-integrity analysis, and thermal analysis.
• Prior experience influencing product direction through structured customer feedback and usage cases.

Education Requirements

Bachelor's, Master's, or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field is expected; equivalent practical industry experience is acceptable.

About the Company

Company: Synopsys

Headquarters: Mountain View, California, USA

Synopsys is a leading company in electronic design automation (EDA) and semiconductor IP solutions. It provides tools and services for designing and verifying complex semiconductor devices and systems. The company plays a pivotal role in the semiconductor industry, helping engineers innovate and deliver higher-quality products faster. Synopsys is committed to advancing technology standards and offers a range of software and hardware solutions to its clients globally.