Applications Engineer, 3D-IC Solutions Sales (Japan)

Job Title

Applications Engineer, 3D-IC Solutions Sales (Japan)

Role Summary

The Applications Engineer will drive technical design wins for Siemens EDA 3DIC and packaging solutions by delivering technical presentations, product demonstrations, benchmarks, and proof-of-concept integrations. The role supports sales activities and collaborates with product and global engineering teams to develop flows and integration scripts that enable 3DIC solutions.

Territory focus is key accounts in Japan with coordination across international peers; occasional domestic and international travel may be required.

Experience Level

Mid-level. The posting requests approximately 4–5+ years of relevant design or semiconductor packaging experience.

Responsibilities

The primary responsibilities are pre-sales technical enablement, customer engagement, and solution integration for 3DIC and packaging workflows.

• Secure technical design wins for Innovator3D Integrator/Layout, Calibre 3DIC family (3DStack, 3DThermal, 3DPERC, 3DStress) and related tools.
• Deliver technical presentations, product demonstrations, benchmarks, and training to customers.
• Develop and prototype 3DIC flows and integration scripts linking Siemens tools into end-to-end solutions.
• Perform benchmark tests and analyze customer design data to validate solutions.
• Provide technical pre-sales support in collaboration with sales teams and relay market/customer feedback to product teams.
• Coordinate status and technical plans with global peers and stakeholders.

Requirements

Must-have and preferred technical skills, tools experience, and competencies for effective performance in this role.

• Must-have: Several years of hands-on experience in semiconductor packaging, 3DIC/2.5D/SiP technologies (TSV, interposer, RDL, microbumps) and EDA tool use for packaging and backend flows.
• Must-have: Proficiency with IC data formats (Verilog, LEF/DEF, GDS, OASIS) and practical experience with placement & routing, parasitic extraction, DRC/LVS, thermal and power/signal integrity tools.
• Must-have: Scripting and automation skills (Python, Tcl, Perl or similar) and working knowledge of Windows and Linux environments.
• Must-have: Customer-facing pre-sales experience, strong presentation and documentation skills, and business-level Japanese plus strong English communication skills.
• Preferred / Nice-to-have: Familiarity with Siemens Innovator3D IC Integrator, Cadence System Planner, Synopsys 3DIC Compiler, Cadence APD/SiP, Siemens Xpedition, Aprisa, Calibre DRC/LVS/3DSTACK, and common P&R tools (Synopsys, Cadence).
• Preferred: Understanding of ASIC design flows (RTL-to-GDS), experience with chiplet methodologies, and familiarity with 2.5D/3D packaging technologies (CoWoS, InFO, EMIB, Foveros, etc.).

Education Requirements

The posting specifies MSEE or BSEE (MSEE/BSEE) with 4+ years of design experience. Additionally, a separate requirement lists 5+ years of practical experience in semiconductor packaging technologies. (Degrees in electrical engineering or closely related technical fields are referenced in the original qualifications.)

About the Company

Company: Siemens

Headquarters: Munich, Germany

Siemens EDA is a leading global provider of Electronic Design Automation (EDA) products and systems. Their innovative solutions enable companies to enhance the development of electronic products efficiently and effectively, keeping pace with the complex demands of technology and physics. Siemens is committed to delivering advanced workflow solutions that integrate both EDA and MCAD tools for multi-domain design and manufacturing in the semiconductor industry.