Advanced Packaging Top Die Module Engineer

Job Title

Advanced Packaging Top Die Module Engineer

Role Summary

Own and develop high-volume manufacturing equipment and processes for advanced packaging top-die modules within Intel Foundry's manufacturing organization. Responsible for ensuring process control, equipment qualification, maintenance, and scaling technology to production volumes across sites.

Collaborate with cross-functional teams and equipment suppliers to improve safety, quality, cost, productivity, defectivity, and yield.

Experience Level

Entry-level (0–3 years of industry experience typical).

Responsibilities

Key responsibilities include:

• Own and operate critical high-volume equipment and associated process modules.
• Perform tests and measurements to control critical dimensions and defectivity.
• Recommend and implement equipment and process modifications to improve efficiency, quality, and cost.
• Scale in-situ manufacturing capacity and transfer the technology to other manufacturing sites.
• Execute and manage equipment maintenance, repair, and qualification activities; work with equipment suppliers as needed.
• Drive continuous improvement across safety, quality, cost, productivity, defects, and yield metrics.
• Develop and optimize excursion-prevention and process-control systems for equipment and processes.
• Lead equipment installation/conversion and qualification during factory ramps to meet installation, safety, and manufacturing readiness criteria.

Requirements

Must-have technical skills and conditions:

• Proficiency in statistical process control (SPC) and data analysis for process optimization.
• Hands-on experience in process monitoring, troubleshooting, and implementing improvements.
• Expertise in tool qualification, equipment maintenance, and high-volume manufacturing processes.
• Experience working with equipment suppliers and supporting installation and qualification activities.
• Ability to analyze complex data, identify trends, and communicate results to support decisions.
• Regular on-site presence is required; this role is not eligible for Intel immigration sponsorship.

Preferred:

• Experience with process and equipment development, including installation, qualification, and optimization.
• Familiarity with DOE, FMEA, or other model-based problem-solving techniques.
• Strong communication and leadership skills; ability to lead cross-functional teams.

Education Requirements

Minimum: Bachelor's degree in Electrical, Chemical, or Mechanical Engineering; Materials Science; Physics; Optics; Chemistry; or a related STEM field with 2+ years of industry experience; OR Master's in those fields with 1+ year industry experience; OR PhD in those fields with 6+ months industry experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.