Advanced Packaging Dry Etch Module Development Manager
Intel CorporationJob Title
Advanced Packaging Dry Etch Module Development Manager
Role Summary
Lead development and implementation of plasma dry etch processes for Intel's advanced packaging portfolio (including Foveros Direct, Foveros, and EMIB). Manage a team of process engineers while remaining technically engaged in plasma physics and etch system optimization.
Work within Intel Foundry to deliver production-ready etch processes, enable high-volume manufacturing, and support cross-functional technology transfer to manufacturing operations.
Experience Level
Senior — 10+ years of relevant industry experience with a Master’s degree, or 8+ years with a PhD (as specified in the posting).
Responsibilities
Primary responsibilities include:
- Lead and manage a team of process engineers: set goals, coach, and perform performance management.
- Define long-term process roadmaps and strategies for advanced packaging etch technology.
- Oversee development and qualification of production-worthy etch processes for high-volume manufacturing.
- Plan and execute project schedules; track milestones and deliverables; coordinate cross-functional feedback.
- Drive yield improvement and defect-reduction initiatives related to dry etch modules and segments.
- Partner with process integration and manufacturing operations to enable successful technology transfer.
Requirements
Must-have and preferred technical skills and experience.
- Must-have: Hands-on plasma physics experience and experience with etch platforms such as ICP, CCP, and RIE systems.
- Must-have: Semiconductor industry experience and track record in process development for manufacturing.
- Must-have: Project management experience including schedule development, deliverable tracking, and cross-functional coordination.
- Must-have: Demonstrated ability to lead engineering teams and drive technical excellence.
- Nice-to-have: Vendor relations experience, materials quality assessment, and supplier performance management.
- Nice-to-have: Strong knowledge of Design of Experiments (DOE), problem-solving methodologies, and package interconnect technologies.
Education Requirements
Master's or PhD in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field. The posting specifies 10+ years of relevant experience with a Master’s degree, or 8+ years with a PhD.
About the Company
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
