The ADCE Packaging Design Architect will join Intel's Advanced Design Customer Enabling (ADCE) group within the Assembly Packaging Technology manufacturing organization (APTM). This role involves defining Package and Disaggregation Architecture across various Intel product portfolios and optimizing product performance and cost at the package and system level.
Senior level, requiring 4-8 years of relevant experience depending on the degree held.
The candidate will be responsible for:
Minimum qualifications include:
Bachelor's (8+ years of experience), Master's (6+ years), or PhD (4+ years) in Electrical Engineering, Chemical Engineering, Mechanical Engineering, or Material Science.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
