Qualcomm logo

3DIC Yield Engineer, Sr. Staff

Qualcomm
April 16, 2026
Full-time
On-site
Hsinchu, Hsinchu City, Taiwan
Level - Senior

Role Summary

We are looking for a highly skilled 3DIC Yield Engineer to advance data-driven yield learning for advanced 2.5D and 3DIC products. The engineer will analyze a wide range of diagnostic data to identify patterns and root causes for yield improvement.

Experience Level

Senior level; requires 4 to 6 years of relevant experience depending on degree.

Responsibilities

The key responsibilities include:

  • Analyzing large-scale failure data from wafer sort and final test.
  • Interpreting memory bitmap diagnostic data and classifying fail modes.
  • Evaluating TSV/interposer failures and performing clustering of root causes.
  • Correlating diagnostic results with layout and process metadata.
  • Developing scripts and tools for automation of analysis.
  • Collaborating with various engineering teams to validate findings.

Requirements

Applicants must meet the following qualifications:

  • Bachelor's degree in Science, Engineering or related field and 6+ years of ASIC-related experience, or a Master's degree plus 5+ years, or a PhD with 4+ years.
  • Proficiency in Python or similar languages for data analysis.
  • Strong understanding of semiconductor test results and diagnostics.
  • Excellent English communication skills.

Education Requirements

Bachelor's degree in Science, Engineering or related field; advanced degrees preferred.


About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.

Qualcomm logo

Date Posted: 2026-04-16