3D IC Solutions Engineer - Package Design Engineer - EDA

Role Overview

Siemens EDA is seeking an experienced and motivated individual to join the 3D IC Solutions Engineering team as the package design lead. This role focuses on developing workflow solutions for advanced 3D System in Package (SIP) designs, integrating various engineering disciplines utilizing Siemens' EDA and MCAD tools.

Experience Level

This position is tailored for senior-level professionals with a proven background in electronic design automation and package design engineering.

Core Responsibilities

The main duties include: driving the development of workflows for physical design planning, layout and verification of 3D IC designs; leading package/chiplet level functional planning, connectivity checks, and verification processes; collaborating with internal teams on integrating workflows; and providing technical support to sales and marketing teams. This role may require occasional travel for customer engagement.

Qualifications and Skills

Ideal candidates will possess: a BS or MS in Electrical/Computer Engineering or related fields; extensive experience in package design and verification; proficiency with advanced packaging IC EDA tools; strong scripting skills in Python or Tcl; and familiarity with both Windows and Linux operating systems. Knowledge in thermal and mechanical stress analysis is advantageous.

Education Requirements

BS or MS in Electrical/Computer Engineering or equivalent experience required.