3D-IC Methodology Architect

Job Title

3D-IC Methodology Architect

Role Summary

Technical lead responsible for defining and delivering 3D-IC design and verification methodology for multi-die systems. The role leads methodology development, partners with EDA vendors and internal product teams, and drives standards across organization and customers with technical focus on EMAG, thermal and package flows.

Experience Level

Senior — requires extensive industry experience (15+ years overall; >10 years in relevant design or design enablement of IPs).

Responsibilities

Accountable for methodology architecture, delivery, and team leadership across heterogeneous integration flows.

• Define and develop 3D-IC design and verification methodology for wafer-to-wafer and die-to-wafer systems.
• Lead and mentor technical teams; specify and scope methodology work items.
• Drive standards and adoption across the organization, customers, and vendors.
• Partner with EDA vendors, PDK teams and internal design teams to develop EDA flows and integrations.
• Scope customer requirements with product management and marketing to enable market adoption of flows.
• Collaborate with cross-geo, cross-functional teams and communicate resolutions in a timely manner.
• Develop training and enablement for internal designers and customers on heterogeneous integration flows.
• Collaborate with programming and technical design leads on multiple concurrent projects to build automation and tools.
• Follow and promote Environmental, Health, Safety & Security requirements and safe work practices.

Requirements

Must-have technical skills and experience.

• Expertise in methodology design and model verification for RF, AMS, silicon photonics and packaging design for multi-die integration (wafer-to-wafer, die-to-wafer).
• Deep knowledge of industry-standard EDA tools and flows and of analog/RF/AMS and digital design EDA flows to define integration requirements.
• Proven experience partnering with EDA vendors and integrating EDA development flows.
• Strong Unix proficiency and experience with version control, configuration management and regression processes.
• Excellent technical written and verbal communication skills; ability to work with cross-functional, cross-geo teams.
• Demonstrated mentoring and team leadership capabilities.
• Ability to manage multiple concurrent projects and collaborate with software/automation teams.
• Fluent in English (written and verbal).
• Preferred: Java coding experience and/or coursework in generative AI; project management and strong planning/organizational skills.

Education Requirements

Degree required: Bachelor of Engineering (B.E.)/B.Tech or equivalent; preferred advanced degrees (M.S./M.Tech/PhD) in Electrical Engineering or a related technical field. Equivalent practical experience acceptable where specified.

If you need a reasonable accommodation for any part of the employment process, contact: usaccommodations@gf.com.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.