Job Title
2026 Intern(3 months)-Physical Design Engineer
Role Summary
The role involves assisting in physical design engineering tasks including handling synthesis, logic insertion, and physical design tasks from Verilog netlist to GDS. The intern will work on various aspects of chip/block floorplans and perform analysis using timing check tools.
Experience Level
Internship position, targeting candidates with less than 2 years of experience.
Responsibilities
Key responsibilities include:
- Handling synthesis/DFT logic insertion and ATPG pattern generation.
- Executing physical design tasks from Verilog netlist to GDS.
- Managing chip/block floorplan and physical design implementation, including placement, CTS, PCTS, routing, and timing analysis.
- Performing timing fixes and signoff with Primetime tool.
- Completing DRC/ERC/PERC/LVS checks.
Requirements
Must-have skills include:
- Familiarity with VLSI and implementation flow.
- Proficiency in a Linux system environment with scripting skills.
- Good writing and speaking skills in English.
- Interest in synthesis, DFT, and digital back-end design.
- Strong communication skills and a team-working spirit.
Nice-to-have qualifications:
- Experience in SCAN insertion and knowledge of Mentor's TK tools.
- Experience in MBIST insertion.
- Familiarity with back-end design tools such as ICC2/INN/ICC/PT.
- Knowledge of timing checks and timing closure.
- Understanding of semiconductor processes and foundry DRC rule decks.
Education Requirements
Not specified.
About the Company
Company: Qualcomm
Headquarters: San Diego, California, United States
Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.

Date Posted: 2026-04-22