2.5D/3D Process Development Engineer

Role Overview

The 2.5D/3D Process Development Engineer will play a crucial role in driving the company’s AI products from concept to high-volume manufacturing. This involves managing and advancing assembly process technology in collaboration with foundries and OSATs, ensuring designs meet manufacturing, reliability, and cost requirements.

Experience Level

10+ years of experience in semiconductor packaging and process technology development is required. Familiarity with advanced foundry process nodes and their interaction with packaging technologies is essential.

Key Responsibilities

• Lead the process development of 2.5D/3D CoW packaging, focusing on chemistry development with packaging consumable suppliers.
• Manage qualification of packages while addressing physics of failure to ensure high thermo-mechanical reliability.
• Oversee internal and external resources to align with corporate milestones effectively.
• Drive ideation and innovation for advanced packaging solutions, collaborating with vendors to enhance productization efforts.

Essential Requirements

• Expert understanding of advanced packaging technologies and their integration with various package forms.
• Proven history of guiding products through technology development, design, and qualification stages.
• Strong project management skills, with effective communication abilities to relay technical and project status.
• Excellent problem-solving skills, analytical abilities, and a deep understanding of operational processes.
• Ability to work independently and see projects through to completion with minimal supervision.

Education Requirements

A Master’s or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or Physics is required.