Sr RF Module Design Engineer

Role Summary

We are looking for a Sr RF Module/Packaging Design Engineer responsible for the development of innovative, cutting-edge RF/Microwave module/packaged products. This position requires designing and developing single or multi-chip modules that integrate GaN, GaAs, or Silicon-based MMICs in various advanced packaging technologies.

Experience Level

Professional

Responsibilities

• Individual Contributor for RF/mm-wave single or multi-chip module (MCM) based product development.
• Integrate MMIC(s) into air cavity or over molded modules towards innovative product solutions.
• Advanced package design using 2.5D and 3D electromagnetic simulators.
• Product checkout, optimization, and design verification testing (DVT) in the test lab.
• Execute DVT analysis and present results to the internal and/or external customer.
• Support product through critical lifecycle stages including concept/feasibility, development, qualification, and production.

Requirements

• Experience in integrating microwave/millimeter-wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, etc., in single or multichip air-cavity or over-mold transmit/receive front-end modules (FEMs).
• Expert-level user in 3D EM simulation tools such as HFSS and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
• Expert in analyzing performance tradeoffs of FEMs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
• Strong understanding of electromagnetic theory and RF fundamentals such as s-parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
• Hands-on experience in microwave measurements, characterization, and calibration methods.
• Knowledge of advanced semiconductor technologies such as GaN, GaAs, and/or Silicon.
• Broad knowledge of semiconductor RF / power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub-assemblies.
• Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.

Education Requirements

• BS Electrical Engineering with 5 or more years of experience
• MS Electrical Engineering with 3 or more years of experience
• PhD Electrical Engineering (with RF/Microwave focus) with 1 or more years of experience