This role is for an experienced Signal and Power Integrity engineer responsible for creating and analyzing System-in-Package designs. The focus will be on ensuring the optimal implementation of Arm IP that enhances performance and reliability in system designs. You will also deliver methodologies for robust silicon/platform electrical integrity solutions, working collaboratively across multiple locations.
Candidates should have a minimum of 5 years of relevant experience in Signal Integrity, particularly in system-level analysis and interface designs. You must be comfortable with SIPI analysis environments and have a detailed understanding of interface constraints impacting system designs.
You must hold an engineering degree (or equivalent) and have extensive experience with SIPI analysis tools such as Ansys and Cadence. A robust understanding of matrices and electromagnetic extraction methodologies is essential. Experience with advanced packaging techniques, a solid background in power integrity, and proficiency in Linux and scripting languages will be required.
Candidate must possess at least an engineering degree or equivalent qualifications related to the field.