Principal Engineer, Signal Integrity

Job Title

Principal Engineer, Signal Integrity

Role Summary

Lead signal integrity analysis and implementation for high-speed SerDes, memory interfaces, and board/package designs. Work within the hardware engineering organization to define SI requirements, perform simulation and measurement, and drive design improvements across PCB, package, and chip interfaces.

The role partners with PCB, package, architecture and test teams and provides technical leadership for SI methods, models and verification across product development cycles.

Experience Level

Senior-level. Expected to have substantial technical experience in signal and power integrity (typical hire: 8+ years, but specific years not specified in source).

Responsibilities

Primary responsibilities include analysis, verification, and cross-domain coordination to ensure signal integrity goals are met.

• Lead SI analyses for high-speed interfaces (e.g., SerDes, DDR, PCIe) across chip-package-board domains.
• Develop and validate SI models (S-parameters, IBIS-AMI, channel models) and simulation flows.
• Perform time- and frequency-domain simulations and correlate with lab measurements (TDR, VNA, bit-error-rate testing).
• Collaborate with PCB and package designers to define stackups, routing guidelines, and mitigation strategies for crosstalk and return-path discontinuities.
• Establish test plans, review prototypes, and support debug and failure analysis during bring-up.
• Mentor engineers, review designs, and document SI best practices and design rules.

Requirements

Technical skills and practical experience needed to perform the role.

• Extensive hands-on experience with SI simulation and measurement tools (examples: Cadence Sigrity, Ansys HFSS/HFSS SI, Keysight tools, SPICE-level tools).
• Proven experience with channel modeling, S-parameters, IBIS-AMI modeling, and SerDes/DDR analysis.
• Strong understanding of signal and power integrity phenomena (crosstalk, reflections, impedance control, PDN analysis).
• Experience correlating simulation with lab measurements (TDR, VNA, oscilloscope, BER testers) and driving corrective design changes.
• Programming or scripting skills for automation and data analysis (e.g., Python, MATLAB).
• Excellent communication skills for cross-functional collaboration and technical documentation.
• Nice-to-have: experience with package co-design, board bring-up, and production test support.

Education Requirements

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Mathematics, or a related technical field, or equivalent practical experience. Advanced degrees (MS/PhD) in relevant fields are a plus. No specific certifications were listed.

About the Company

Company: Rambus

Headquarters: Sunnyvale, California, USA

Rambus is a global leader in advanced semiconductor and technology solutions, specializing in enhancing data access and improving performance in computing, networking, and storage applications. The company is known for its innovative IP and solutions in memory, security, and interface technologies. With a strong focus on research and development, Rambus continues to push the boundaries of technology to meet the growing demands of the digital age.