Package Layout Design Intern
Marvell TechnologyJob Title
Package Layout Design Intern
Role Summary
The Package Layout Design Intern will be part of a team responsible for integrated circuit package designs. The role involves applying layout practices to meet electrical and thermal requirements for high-performance applications.
Experience Level
Entry-level; 0-1 years of previous experience.
Responsibilities
Key responsibilities include:
- Designing flip-chip package designs using best layout practices.
- Performing integrity analysis of packaging with appropriate tools.
- Collaborating with the PKG SI/PI team to enhance layout solutions for better electrical performance.
- Carrying out other related responsibilities as required.
Requirements
Candidates should meet the following requirements:
- Currently pursuing a Bachelor’s degree in Electronics, Computer Science, or related fields.
- Basic electronics knowledge including circuits and circuit simulation.
- Basic layout knowledge, including routing and PCB design rules.
- Familiarity with signal theory and electric simulations.
- Experience with PCB routing projects is a plus.
- Strong communication and team collaboration skills.
- Proficient in spoken and written English.
Education Requirements
Must be pursuing the 3rd year of a Bachelor's degree in a technical field.
About the Company
Company: Marvell Technology
Headquarters: Santa Clara, California, United States
Marvell’s semiconductor solutions serve as essential building blocks of the data infrastructure connecting our world, driving innovation across enterprise, cloud, AI, and carrier architectures. The company focuses on creating transformative technology that shapes the future.
