Module Engineer (Contract Role)

How would you like to work in an organization that provide diverse and inclusive workplace where everyone respects and builds trust with each other? Intel Vietnam is the largest factory in Intel’s global Assembly and Test network and a critical site for our IDM2.0 strategy. We are looking welcome a Module Engineer into our team! A highly energetic individual with strong technical background to drive engineering solutions and enable new technology transfers. **Responsibilities:** - Empowered to lead critical resolution of operational needs for the Assembly process and equipment. - Optimize advanced process control systems to detect signals and automate defect containment. - Define maintenance and calibration procedures, partnering with technicians and manufacturing teams to sustain equipment OEE standards. - Responsible to engage and lead new technology development, product transfers and process integration. - Discover breakthrough innovations in process and equipment, with a focus on generating patentable solutions. - Spearhead Factory of the Future transformation through AI and Robotics deployment. - Actively engaged in our Virtual Factory (VF) network, driving cross site learnings and problem resolution. **Qualifications:** - Bachelors or Masters degree in following Engineering fields – Electrical and Electronics, Mechanical, Mechatronics, AI/Robotics, Chemical and/or other related majors. - Fresh graduates are invited to apply for the Module Engineer entry-level position. - Strong English articulation and written communication skills. - Self-motivated, team-oriented individual with a strong data driven mindset. Willingness to hand on and positive learning attitude. **Preferred:** - Highly knowledgeable in statistical and problem-solving tools like 8D, FMEA, Lean Six Sigma methodology, JMP statistical analysis is a must for experience candidate. - Expertise in Machine Learning and Robotics with proficiency in Python, OpenVino, Tensorflow, C++, ROS (Robot Operating System), MATLAB, Gazebo, V-REP, Webots and familiarity with embedded systems and real-time programming. - Preferred Experience in Advance Packaging, Package Technology Development and semiconductor packaging with specific focus on Equipment design, DFA/DFM design rules, PFMEA assessments and developing control plans to enhance process capability. - Experience working with direct material, thermal mechanical and modelling.

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About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Based in Mexico, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

Date Posted: 2026-03-12