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HBM SIPI, Principal Engineer

Micron Technology
April 27, 2026
On-site
Richardson, Texas, United States
$175,000 - $309,000 USD yearly
Level - Senior

Job Title

HBM SIPI, Principal Engineer

Role Summary

Senior signal-integrity and power-integrity (SI/PI) technical authority focused on system-level HBM (High Bandwidth Memory) designs. The role is part of the Heterogeneous Integration Group within Technology and Products and supports next-generation 2.5D/3D interposer-based HBM solutions.

Primary responsibilities include defining SI/PI architecture, setting sign-off criteria, performing electromagnetic and transient analysis, and providing technical direction from concept through production.

Experience Level

Senior. The posting specifies a minimum of 7 years of relevant experience with preferred candidates having 10+ years.

Responsibilities

Technical ownership and leadership for SI/PI across package, interposer, and PCB for HBM systems.

  • Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency- and time-domain evaluation.
  • Define and drive power-delivery architecture, impedance targets, and transient PDN analysis.
  • Perform electromagnetic extraction and modeling across PCB, package, and interposer designs.
  • Establish SI/PI standards, methodologies, and sign-off criteria for HBM system designs.
  • Provide clear technical direction in ambiguous or incomplete design environments; influence architecture from concept to sign-off.

Requirements

Must-have vs. nice-to-have qualifications.

  • Must-have: At least 7 years of experience in signal integrity and power integrity modeling and analysis.
  • Must-have: Strong understanding of SI/PI fundamentals, electromagnetics, transmission-line theory, and I/O design.
  • Must-have: Hands-on experience with industry-standard SI/PI EDA tools such as ANSYS, Synopsys, Cadence, or Keysight.
  • Nice-to-have: Direct ownership of system-level SI/PI sign-off for production silicon.
  • Nice-to-have: Experience with 2.5D/3D advanced packaging and interposer-based designs.
  • Nice-to-have: Background with high-bandwidth interfaces (HBM, DDR, SERDES, UCIe).
  • Nice-to-have: Scripting experience (TCL and/or Python) to automate SI/PI analysis flows.

Education Requirements

Not specified.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-04-27