Director, PDE Advance Packaging (NPI)

Job Title

Director, PDE Advance Packaging (NPI)

Role Summary

Provide strategic and operational leadership for the Advanced Technology PEE & PIE team within Package Development & Engineering (PDE). The role owns New Product Introduction (NPI) execution for advanced packaging technologies, ensuring on-time product qualification and transition to High Volume Manufacturing (HVM) through cross-functional alignment.

This is a hands-on leadership role that directs engineering and manager-level staff, sets NPI strategy and tactics, and engages senior stakeholders across PDE, APTD, Global Quality, and Manufacturing.

Experience Level

Senior — typically requires 10+ years in semiconductor manufacturing and 5+ years in a people leadership role.

Responsibilities

Main responsibilities include leading NPI execution, coordinating cross-functional teams, and driving technical and operational readiness for advanced packaging product introductions.

• Set strategic direction and lead the PDE NPI team through all phases of New Product Introduction to ensure repeatable, on-schedule qualification into HVM.
• Own NPI execution plans, deliverables, milestones, and Defense Line readiness (quality control plans, OCAP/SPC, FMEA) prior to product release.
• Partner with APTD, PDE, PSE, Global Quality, TSE, Site Manufacturing, and Central Planning to identify risks early and drive resolution.
• Serve as liaison for process transfers, tool readiness, and qualification schedules; lead Phase Gate Reviews and executive program updates.
• Oversee NPI lots, data collection, process characterization, yield ramp activities, and execution of POS, VMP, and DMP programs.
• Lead root cause analysis (RCA) and CAPA for NPI-related excursions and quality issues; ensure MRDA and ADC readiness and sampling/inspection strategies.
• Lead, develop, and coach engineers and managers; manage organizational structure, staffing, performance, succession planning, and resource allocation.
• Establish and monitor NPI KPIs (e.g., MLY, Process Cpk, Lot Disposition TAT, Phase Gate exit rates) and drive Continuous Improvement Programs to meet yield and capability targets.
• Integrate AI-assisted tools and data analytics into NPI workflows to improve decision speed, yield prediction, and operational efficiency.

Requirements

Summarized must-have and preferred qualifications.

Must-have:

• 10+ years of experience in semiconductor manufacturing with strong background in process engineering, NPI, or technology development.
• 5+ years in a people leadership role managing multi-functional engineering teams.
• Deep understanding of backend/assembly semiconductor processes and NPI phase gate frameworks.
• Proven track record delivering NPI milestones on time in a 24/7 manufacturing environment.
• Strong analytical skills and proficiency with data analysis tools (e.g., JMP, Python, or equivalent).

Preferred / Nice-to-have:

• Experience with advanced packaging technologies (HBM, 3D stacking, wafer-on-wafer).
• Experience working across global, cross-functional teams spanning multiple geographies.
• Ability to influence and present to senior executives and cross-functional leaders.

Education Requirements

Bachelor's degree or higher in Engineering, Materials Science, Chemical Engineering, or a related technical field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.