Design Engineering Intern

Role Summary

The Design Engineering Intern will assist in producing and implementing designs that meet customer specifications for various semiconductor solutions.

Experience Level

Support

Responsibilities

• Producing and implementing designs for low-cost and thermally efficient package platforms.
• Working on LTE, carrier aggregation, multiple antennas, filters, and power management.
• Ensuring ruggedness, ESD, and quality while meeting performance requirements.
• Utilizing measurement equipment to compare simulated data with real lab data.
• Partnering with technicians for circuit simulations and testing.
• Designing, testing, and tuning RF power amplifiers (PAs).
• Developing application guidelines for package assembly.
• Creating algorithms for automating FEA model generation.
• Engaging in analog and RF measurement activities.

Requirements

• Currently pursuing a BS, MS, or PhD in Electrical or Mechanical Engineering.
• Minimum GPA of 3.0.
• RF circuit design coursework or experience strongly preferred.
• Exposure to RF measurement equipment preferred.
• Proficiency in Microsoft Office.
• Familiarity with software such as ADS, FEM, HFSS, and 3D CAD.
• Strong communication and organization skills.
• Detail-oriented approach to design and product delivery.

Education Requirements

Currently pursuing a BS, MS, or PhD in Electrical or Mechanical Engineering.