Advanced Semiconductor Package Design & Development Leader

Job Title

Advanced Semiconductor Package Design & Development Leader

Role Summary

Lead the design and development of advanced semiconductor packages (FCBGA, 2.5D, SiP/chiplet) and package-mounted boards for automotive SoC products. Drive overall specifications, architecture and high-level design decisions while coordinating across SoC architecture, layout, package and board teams.

Serve as a technical leader in the Engineering department in Kodaira, responsible for defining development strategy, leading interposer and chiplet design efforts, and conducting technical reviews with design engineers and stakeholders.

Experience Level

Senior — technical lead/manager level. The posting indicates a leadership role; specific years of experience are not stated.

Responsibilities

Primary responsibilities focus on specification definition, design leadership, and cross-functional coordination for advanced package and board development.

• Translate requirements into high-level and detailed package/board specifications.
• Define development and design strategies for advanced package solutions.
• Perform architecture and concept design for devices and system modules using chiplets.
• Lead interposer design to satisfy interface and power requirements for high-speed interfaces and DRAM.
• Coordinate technically with design engineers and conduct design reviews.
• Collaborate with SoC layout, package, and board teams to ensure integrated system-level solutions.

Requirements

Must-have and preferred skills and experience relevant to the role.

• Must-have: Experience in semiconductor package design or board/substrate design.
• Experience with communication interfaces or DRAM interface circuit design.
• SI (signal integrity) / PI (power integrity) verification experience.
• Comfortable participating in technical meetings and confirming specifications in English.
• Japanese: business level; English: conversational / daily conversation level.

Nice-to-have:

• Chiplet design experience.
• Package structure design and verification experience.
• Board-level circuit design experience.
• Power design experience.

Education Requirements

Not specified.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.