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USB Lead Engineer — Linux Enablement & AVV (Pre/Post-Silicon) — RISC‑V MPU Platform

GlobalFoundries
May 22, 2026
Full-time
On-site
Pune, Maharashtra, India
Test Engineering Jobs, Level - Senior

Job Title

USB Lead Engineer — Linux Enablement & AVV (Pre/Post-Silicon) — RISC‑V MPU Platform

Role Summary

Technical owner for USB enablement on a 64-bit RISC‑V MPU Linux platform. Responsible for driver bring-up, kernel/BSP integration, SDK readiness, and automated validation from virtual platforms and FPGA through first silicon.

Works within the Platform Software team and partners with architects, RTL/PHY, board, and platform teams to de-risk the USB subsystem and deliver production-quality SDK releases.

Experience Level

Senior — typically 8–15 years of relevant experience in Embedded Linux platform/BSP and device-driver development.

Responsibilities

Deliver end-to-end USB enablement, validation, and integration across pre-silicon and first-silicon platforms.

  • Lead USB enablement across the stack: boot-to-user-space on a RISC‑V MPU Linux platform.
  • Bring up USB controllers (xHCI/EHCI for host, UDC for device), integrate PHY, clocks, resets, and interrupts.
  • Drive kernel/BSP enablement: Device Tree bindings, power management, suspend/resume, and performance tuning.
  • Develop and debug USB drivers and related subsystems (usbcore, HCD, gadget framework, class drivers).
  • Enable and validate user-space workflows: enumeration, throughput/latency, storage/networking classes, and hot-plug reliability.
  • Produce USB-ready SDK releases with integration, regression validation, and developer-facing documentation.
  • Create AVV test plans and automation to validate USB functionality, performance, and compliance on FPGA/emulation and first silicon.
  • Debug and root-cause HW/FW/kernel issues using logs, traces, and lab equipment (JTAG, logic/protocol analyzers); drive fixes to closure.
  • Collaborate on feature planning, requirements (role/port matrix, power/charging, compliance), and bring-up milestones with cross-functional teams.
  • Support OEM/Tier‑1 bring-up and contribute upstream fixes where appropriate.

Requirements

Required technical skills and experience for immediate contribution.

  • 8–15 years experience in Embedded Linux platform/BSP and device-driver development.
  • Expert-level C programming; experience reading and modifying kernel, driver, and low-level firmware code.
  • Strong Linux internals knowledge: boot flow, memory/interrupt subsystems, concurrency, and performance debugging.
  • SoC/platform bring-up experience including high-speed I/O enablement and ownership of subsystem quality.
  • Hands-on with U-Boot, Linux kernel, Device Tree, and Yocto/OpenEmbedded; experience integrating and validating USB in BSP/SDK releases.
  • Proficient with GDB and at least one of OpenOCD/JTAG, Lauterbach, or similar debug tools for complex HW/SW interactions.
  • Experience with FPGA, emulation, or early-silicon platforms for bring-up and validation.

Nice-to-have:

  • Deep USB knowledge (USB2/USB3) and familiarity with Linux USB architecture and compliance testing.
  • Exposure to USB Type-C/PD, retimers, and Alt Modes (e.g., DisplayPort).
  • Familiarity with platform security relevant to USB (secure boot, firmware/OS boundaries).
  • Experience with QEMU, virtual platforms, or emulation workflows for early driver/test development.
  • Experience with CI/CD and automated validation frameworks (Python/shell test frameworks, dashboards, regressions).

Education Requirements

B.E./B.Tech or M.E./M.Tech in Computer Engineering, Electrical Engineering, or a related field.


About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.

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Date Posted: 2026-05-21