Staff IC Substrate Development Engineer

Job Title

Staff IC Substrate Development Engineer

Role Summary

Join Qorvo's RF Packaging Center of Excellence to develop and qualify high-density PCB/IC substrate technologies for RF semiconductor products. The role partners with design teams and global suppliers to advance substrate materials and manufacturing from concept to high-volume production.

Primary focus areas include substrate material selection, manufacturing qualification, supplier technical support, and cross-functional program execution.

Experience Level

Senior-level (Staff). Requires approximately 8+ years of relevant experience or an equivalent combination of advanced education and experience.

Responsibilities

Key responsibilities include technical leadership, supplier engagement, and program execution across substrate development projects.

• Interface between design teams and the worldwide supply base to define substrate technology roadmaps.
• Develop, qualify, and support the clean launch of new laminate PCB material sets and suppliers following corporate processes and documentation standards.
• Design and run material and surface-finish evaluations using screening tests and designed experiments to improve RF performance, MSL rating, cost, or form factor.
• Plan, execute, and monitor complex process and product development projects using program management methods.
• Apply structured problem-solving methods to resolve issues and improve supply-chain and manufacturing capabilities.
• Provide on-site technical support at laminate suppliers for development, qualification, and problem resolution (travel required).
• Collaborate closely with business-unit design and manufacturing teams to enable product ramp and qualification.

Requirements

Required technical skills and experience. Preferred items listed separately.

Must-have:

• Extensive experience in PCB and/or IC substrate manufacturing and qualification for semiconductor applications.
• Strong written and verbal communication and cross-functional collaboration skills.
• Familiarity with assembly and packaging process technologies (SMT, die attach, wire bond/flip chip, molding, multi-layer laminates).
• Practical knowledge of laminate/PCB manufacturing processes (copper pattern plating, panel plating, via drilling, surface finishes).
• Understanding of dielectric materials (prepreg, ABF, RCC) and PCB design rules, manufacturing, and qualification standards.
• Working knowledge of IPC PCB and JEDEC standards.
• Ability to apply SPC techniques, DOE, and structured problem-solving methodologies (e.g., DMAIC, 8D).
• Experience with Design for Manufacturability and ramping technologies into high-volume manufacturing.
• Established supplier network in advanced packaging subcontractors and proven track record supporting new products and processes.
• Must be authorized to work in the United States; the company will not sponsor visas for this position.

Nice-to-have:

• Direct experience with copper plating and/or surface-finish plating processes.
• Project management skills or PMP certification.
• Experience with mSAP laminate fabrication for RF applications.

Education Requirements

Bachelor's degree in Chemistry or an Engineering discipline required. The posting allows 8+ years of experience or an equivalent combination of advanced education and experience in lieu of additional formal degrees. PMP is listed as a preferred certification.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.