Senior Staff Engineer (Design)

Job Title

Senior Staff Engineer (Design)

Role Summary

Lead and execute New Product Introduction (NPI), cost-of-goods-sold (COGS) reduction, and capacity expansion programs for semiconductor packaging products. Work across design, systems, validation, product/test engineering, firmware, supply chain, procurement and quality to ensure program schedules, qualification, and production ramp plans meet customer commitments.

Experience Level

Senior-level role. The posting specifies 8+ years of experience in semiconductor packaging technology and product lifecycle management.

Responsibilities

Accountable for planning, coordinating and driving cross-functional execution for NPI, cost reduction, and capacity programs.

• Lead cross-functional teams to deliver NPI programs and production ramps.
• Manage COGS reduction initiatives from assessment through qualification, PCN and production ramp; quantify savings and evaluate ROI and business impact.
• Plan and execute capacity expansion across global manufacturing sites in coordination with operations and supply chain.
• Create and maintain detailed schedules for NPI, COGS and capacity programs; track progress and implement data-driven mitigation plans.
• Prioritize engineering build requests and conduct regular reviews with PMO and business operations leadership.
• Serve as liaison between product groups, operations/supply chain and OSAT partners to align milestones and execution.
• Drive sample readiness and ramp readiness to meet customer delivery timelines.
• Coordinate and run Project Gate reviews, communicating risks, dependencies and cross-functional readiness.
• Oversee wafer fab, assembly and test operations to ensure schedule adherence, cost control and quality.
• Provide structured program status reports, risk assessments and maintain qualification documentation.

Requirements

Must-have technical skills and professional competencies for successful execution.

• Deep knowledge of semiconductor packaging manufacturing flows, package architectures and production processes.
• Proven ability to lead complex, cross-functional programs in ambiguous environments.
• Program/project management knowledge (coursework, certification, or demonstrated practical experience).
• Strong stakeholder management, clear communication and cross-functional collaboration skills.
• Analytical, organized, strong problem‑solving, time‑management and multitasking capabilities.
• Proficiency in Microsoft Office and project management tools.
• Self-motivated, quick learner, and committed to continuous professional development.
• Nice-to-have: prior experience at an assembly site as a process or integration engineer; familiarity with OSAT interfaces, cost-reduction program execution and qualification flows.

Education Requirements

The posting specifies a Bachelor’s or Master’s degree in Electrical Engineering. It also references program/project management coursework or certification as acceptable background. (The posting pairs the degree requirement with an expectation of 8+ years of related semiconductor packaging and product lifecycle experience.)

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.