Senior Packaging Engineer

Job Title

Senior Packaging Engineer

Role Summary

Join the IC Package Engineering team to develop and evaluate advanced IC packaging technologies. The role focuses on package mechanical characterization, reliability evaluation of advanced packages, and system-level interactions to inform product design and reliability decisions.

This position is office based in San Diego, CA and is U.S.-based (not eligible for visa sponsorship).

Experience Level

Senior. Typical experience guidance from the role: Bachelor's +2 years, Master's +1 year, or PhD (see Education Requirements for details).

Responsibilities

The role requires hands-on experiment design, execution, analysis, and cross-functional collaboration. Key responsibilities include:

• Design and execute reliability experiments (DOE) for package, board-level, and system-level evaluation.
• Perform PCB assembly, rework, and troubleshooting for test vehicles and products.
• Analyze experimental data using statistical methods and reliability modeling (e.g., Weibull analysis).
• Develop and implement new test methodologies for emerging packaging technologies.
• Collaborate with Design, NPI, FA, Thermal, and other engineering teams to drive product decisions.
• Provide guidance to technicians and support laboratory operations and equipment.
• Generate technical reports, documentation, and presentations for internal and customer use.
• Interface with vendors and suppliers for materials, equipment, and process improvements.

Requirements

Required technical skills and practical experience. Degree specifics are listed under Education Requirements below.

• Must-have: Experience in package mechanical characterization and reliability evaluation; ability to design and execute DOEs and translate data into actionable design recommendations.
• Must-have: Hands-on PCB assembly, rework, and lab troubleshooting experience; familiarity with lab operations and directing technician work.
• Must-have: Data analysis skills including statistical methods and reliability modeling (e.g., Weibull analysis).
• Nice-to-have: Experience with mechanical stress/strain characterization methods.
• Nice-to-have: Practical experience with reliability and mechanical test equipment such as thermal cycling chambers, drop shock systems, universal testing machines (Instron/UTM), and high-speed DAQ systems.
• Nice-to-have: Experience with metrology tools such as Shadow Moiré, DIC, TMA, DMA, C-SAM, and X-ray inspection.
• Nice-to-have: Knowledge of industry standards (JEDEC, IPC, ASTM, AEC) and experience working with vendors/suppliers.

Education Requirements

Bachelor's degree in Chemical, Electrical, Mechanical Engineering or a related field plus 2+ years of relevant System/Package Design or Technology Engineering experience; OR a Master’s in those fields plus 1+ year of relevant experience; OR a PhD in those fields (no additional experience required). "Related field" language is permitted. (These degree/experience combinations are the role's stated minimum qualifications.)

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.