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Principal Engineer – Physical Design

Microchip
May 23, 2026
Full-time
On-site
Chandler, Arizona, United States
Physical Design Jobs, Level - Senior

Job Title

Principal Engineer – Physical Design

Role Summary

Lead full-chip APR/physical implementation (netlist-to-GDSII) activities on Microchip’s CAD Physical Design team. Focus on floorplanning, placement optimization, clock tree synthesis, routing, timing closure and sign-off for hierarchical, low-power, multi-mode mixed-signal designs.

Work with a worldwide team to define and execute physical implementation methodologies, drive sign-off readiness, and mentor other engineers.

Experience Level

Senior-level — typically requires 10+ years of relevant physical design experience.

Responsibilities

Primary responsibilities for this role include technical leadership of physical implementation and cross-team collaboration.

  • Lead full-chip APR and physical implementation: floorplanning, placement optimization, CTS, routing, and timing closure.
  • Define and run sign-off flows (STA, formal equivalence, parasitic extraction, power integrity, physical verification).
  • Apply and extend low-power methodologies (UPF) across the physical design flow for multi-mode/multi-corner designs.
  • Resolve signal integrity and crosstalk issues; ensure manufacturable routing and DFM compliance.
  • Develop and maintain automation and scripts to improve physical implementation productivity.
  • Collaborate with RTL, verification, CAD, and foundry teams to meet design goals and resolve issues.
  • Mentor and provide technical direction to distributed engineering teams.

Requirements

Key technical must-haves and preferred skills.

  • 10+ years of hands-on experience in physical design flows and full-chip implementation.
  • Advanced knowledge of place-and-route methodologies, VLSI logic principles, clock structures, and timing closure.
  • Experience with sign-off tools for STA, formal equivalence, parasitic extraction, power integrity, and physical verification.
  • Practical experience with UPF and low-power physical design practices.
  • Daily use of ICC/ICC2 or Innovus preferred.
  • Experience with 40nm or 28nm technologies required; 16nm or smaller preferred.
  • Proficiency in Tcl and Perl scripting.
  • Strong problem-solving skills, and excellent written and verbal communication; able to collaborate across geographically distributed teams.
  • Travel: 0–25%.
  • Physical requirements: primarily sedentary work (approx. 80% sitting), some walking/standing.

Education Requirements

Bachelor’s or Master’s degree in Electrical or Electronics Engineering. The posting specifies these degrees; no alternative "equivalent experience" language or certifications were stated.


About the Company

Company: Microchip

Headquarters: Chandler, Arizona, USA

Microchip is a leading semiconductor company focused on developing innovative solutions to enhance the human experience. With a commitment to empowering innovation, Microchip prioritizes the value of its employees by fostering a culture that supports their growth and contributions.

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Date Posted: 2026-05-24