Engineer, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Job Title

Engineer, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Role Summary

Individual contributor on the Package Development Engineering team for Advanced Packaging in Singapore. Owns technical tasks that support transition of HBM and advanced memory packaging from development into high-volume manufacturing.

Works with development, manufacturing, and supplier teams across Micron’s global network to enable reliable production and accelerate product qualification.

Experience Level

Mid-level. The posting does not specify years of experience.

Responsibilities

Key responsibilities focus on technology transfer, process control, and continuous improvement for HBM packaging.

• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, and effectiveness.
• Identify, test, and share AI-enabled and continuous-improvement enhancements within scope of work.
• Apply engineering and statistical methods (Design of Experiments through product qualification) to accelerate learning cycles.
• Partner with Advanced Package Technology Development (APTD), manufacturing teams, and suppliers to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
• Perform risk assessments and Failure Mode & Effects Analysis (FMEA); implement control plans and corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high-volume manufacturing.
• Collaborate with stakeholders to drive production readiness and resolve technical issues during ramp-up.

Requirements

Must-have skills and work conditions, followed by preferred experience and tools.

• Must-have: Availability for operations support, including shift and weekend coverage.
• Must-have: Strong analytical, logical, and critical-thinking skills; effective communication and collaboration across levels.
• Must-have: Growth mindset and commitment to continuous learning.
• Must-have: Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively.
• Preferred / Nice-to-have: Internship or prior experience in the semiconductor industry.
• Preferred / Nice-to-have: Demonstrated leadership and a track record of impact.
• Preferred / Nice-to-have: Familiarity with MES systems, automation, and data analytics tools (example: JMP, Python).
• Preferred / Nice-to-have: Interest in and knowledge of the semiconductor industry and Micron's products and processes.

Education Requirements

PhD in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline is required. The listing also references semiconductor-industry experience or internships as beneficial but not a substitute for the degree requirement.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.